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GPS Module GE674

Specifications Sheet V0.1


  • SiRF StarIV internal ROM-based ultra low power chipset
  • Compact module size for easy integration : 10.6 x 10 x 2.3 mm
  • GE674 module provide an I2C compliant interface to connect an optional external serial
    * 1 EEPROM to store power-up configuration settings
  • Operating at 1.8V signal level
    * 1 Please refer to the related External EEPROM Application Note

1. Introduction

The GE674 is a high sensitivity, low power ,Surface Mount Device (SMD), that fully utilized SiRF star IV upgraded features. This 48-channel global positioning system (GPS) receiver is designed for a wide range of OEM applications then based on the GPS signal search capabilities of SiRFstarIV GSD4e ROM chipset, SiRF's newest chipset technology.
The GE674 provides flexible bus interface (Optional : UART , I2C or SPI).

GE674 is designed to allow quick and easy integration into GPS-related applications such as:

  • Mobile gaming
  • Cellular handsets
  • Cameras
  • Asset Tracking
  • Other location-aware consumer devices Premium on-chip software provides a new level of continuous location awareness by employing.
  • Opportunistic ephemeris decode and advanced power management, which enable the GPS receiver to stay in a hot-start condition nearly continuously while consuming very little power.
  • *2 Full support for client-based and server-based SiRFInstantFix™
  • 3 Dynamic contextual awareness, temperature monitoring, and MEMS sensors that work in concert to conserve power and boost performance (*2/*3, Above features should be combined with external EEPROM, please refer to application note.)

1.1 Features
1.1.1 Performance

  • High Performance Solution:
    - High sensitivity navigation engine (PVT) tracks as low as -163dBm
    - 48 track verification channels
    - SBAS (WAAS or EGNOS)
  • Active Jammer Remover:
    - Removes in-band jammers up to 80 dB-Hz
    - Tracks up to 8 CW jammers
  • Multimode A-GPS (Autonomous, MS-Based, and MS-Assisted) - Need operator support
  • *4 Embedded CGEE / SGEE (Need b server support) speed up TTFF a lot and makes cold start time to be around 20 seconds
  • SiRFGeoRecov™ Reverse EE makes positioning process being done under power saving mode.
  • Reacquisition Time : 0.1 second
  • RF Metal Shield for best performance in noisy environments ( *4, Above features should be combined with external EEPROM, please refer to application note. )

1.1.2 Hardware and software

  • Based on the high performance features of the SiRF Star IV low power single chipset.
  • Adaptive Micropower Controller :
    - Only 50 to 500 ŁgA maintains hot start capability.
    - <10mW required for TricklePower™ modeRoHS compliant (lead-free)
  • SMT pads allow for fully automatic assembly processes equipment and reflow soldering
  • Advanced Navigation Feature :
    - Smart sensor I2C
    - Interrupt input for context change detection

1.2 Advantages

  • Built-in LNA.
  • Built-in internal ROM and based on Firmware 4.5.x
  • *5 Embed CGEE (Client Generated Extended Ephemeris) that can capture ephemeris data from satellites locally and predicts ephemeris out to 3 days. So if the module was off within 3 days, it could complete positioning process with 2 seconds just like hot start.
  • It can remove in-band jammer up to 80db-Hz and track up to 8CW jammers, so the module can prevent GPS signal interference when design-in the electrical device with noisy electrical signal interferences such as Laptop, mobile phone, DSC, etc.
  • Maintain tracking sensitivity as low as -163dBm, even without network assistance. (SiRF StarIII has only -159 dBm sensitivity)
  • Support SiRF Aware technology
  • Support adaptive "Micro Power Controller" power management mode
  • *6 Support MEMS sensor through I2C interface. (V4.5.X firmware is available for now) MEMS.
  • Only 8mW Trickle Power, so user can leave power on all day instead of power off
  • Suitable for battery drive devices that need lower power consumption application
  • Ideal for high volume mass production (Taping reel package)
  • Cost saving through elimination of RF and board to board digital connectors
  • Flexible and cost effective hardware design for different application needs
    ( *5/*6, Above features should be combined with external EEPROM, please refer to application note.)

1.3 Block Diagram

*7 EEPROM(optional) : The external EEPROM can be part of storage for SiRFstat IV GSD4e, which can add-on more features and benefits for GE674 GPS application.

2. Technical Specifications

2.1. Hardware Features

  • Based on the high performance features of the SiRF Star IV low power single chipset
  • SMT pads allow for fully automatic assembly processes equipment and reflow soldering
  • RoHS compliant (lead-free). Halogen free is to be available

2.1.1 GE674 Module specifications

Feature Item Description
Chipset GSD4e/ROM base SiRF StarIV-low power single chipset
General Frequency L1, 1575.42 MHz
C/A code 1.023 MHz chip rate
Channels 48
Sensitivity -163dB *
Accuracy Position <2.5 meters
Velocity 0.01 meters/second
Time 1 microsecond synchronized to GPS time
Datum Default WGS-84
Other selectable for other Datum
Time to First Fix
(TTFF @-130dBm)
Reacquisition 0.1 sec., average
Snap start 1 sec., average
Hot start 1~2 sec.
Warm start 9~15 sec. *
Cold start 25~35 sec. *
Altitude 18,000 meters (60,000 feet) max.
Velocity 515 meters/second (1000 knots) max.
Acceleration 4g, max.
Jerk 20 meters/second3, max.
Power Main power input 1.71 ~ 1.89 VDC input
Power consumption Average: 53mA (Tracking Mode)
Backup Power 1.71 ~ 1.89 VDC input
Serial Port Electrical interface Default SPI
Protocol messages NMEA-0183
* With external EEPROM

2.2 Pin Specifications

2.2.1 Pin Location

2.2.2 Pin Assignment

1 GND PWR Ground
2 RF_IN I RF input
3 ON-OFF I Power control pin
4 RESET I External reset input, active low
5 VCCIN PWR DC +1.8V input
6 VSTBY PWR DC +1.8V input, RTC backup battery input
7 WAKEUP O External Control for LNA or memory, active high
8 EIT I Interrupt
9 GND PWR Ground
10 TXA O SSPI_DO slave SPI data output (MISO)
UART_TX UART data transmit (TX)
I2C_CLK I²C bus clock (SCL)
11 RXA I SSPI_DI slave SPI data input (MOSI)
UART_RX UART data receive (RX)
I2C_DIO I²C bus data (SDA)
12 CTS I SSPI_CLK slave SPI clock input (CLK)
UART_CTS_N UART clear to send (CTS) active low
13 RTS O SSPI_SS_N slave SPI chip select (CS#) active low
UART_RTS_N UART ready to send (RTS) active low
14 TM O 1 PPS time mark output.
15 CLK I DR_I2C_CLK dead reckoning I²C bus clock (SCL)
16 DIO I/O DR_I2C_DIO dead reckoning I²C bus data (SDA)

2.3 Time Mark (T.M.)

When GPS is fixed, the TM cycle will be shown as below :

2.4 Physical Characteristics

Items Description
Length 10.6 mm ± 0.3mm
Width 10.0 mm ± 0.3mm
Height 2.30 mm ± 0.3mm
Weight 1 g

2.5 Recommended GPS Antenna Specifications

This GE674 receiver is designed for use with passive antenna.
Parameter Specification
Antenna Type Right-hand circular polarized passive antenna
Frequency Range 1575.42 ± 1.023 MHz

2.6 Environment Specification

Items Description
Operating temperature rage -40 deg. C to +85 deg. C
Storage temperature range -55 deg. C to +100 deg. C
Humidity Up to 95% non-condensing or a wet
bulb temperature of +35 deg. C

2.7 ESD Specification

  • Air Discharge: 2 ; 4 ; 8KV ( direct )
  • Contact Discharge: 2 ; 4 KV ( direct / indirect )

2.8 Reference design

  • U2, an External EEPROM is optional.
  • R2 and R3 are the selector for multiple control interfaces which can be the UART, I2C or SPI in different combination.

3. Software

The firmware used on GE674 module is GSD4e, the software for SiRF StarIV low power

  • Excellent sensitivity
  • High configurability
  • Supports use of SBAS(satellite-based augmentation systems), WAAS, EGNOS, MSAS, GAGAN,
  • Enhanced Navigation Performance
  • Improved Jamming Mitigation

The default configuration is as following description:

Item Description
Core of firmware SiRF GSD4e/ROM_4.0.5
Baud rate 4800 bps
Code type NMEA-0183 ASCII
Datum WGS-84
Protocol message GGA(1sec), GSA(1sec), GSV(5sec), RMC(1sec)
Output frequency 1 Hz

3.1 Software Interface

The host serial I/O port of the module's serial data interface supports full duplex communication between the module and the user.

The default serials are shown in Table 3-1.

Port  Protocol Description
UART/I2C/SPI NMEA 0183, 4800 bps GGA(1sec), GSA(1sec), GSV(5sec), RMC(1sec)

Table 3-1 GE674 GPS module default baud rates

3.2 NEMA Output Message

The output NMEA-0183 messages for the receiver are listed in Table 3-2.

Option Description
GGA Time, position, and fix related data for a GPS receiver.
GSA GPS receiver operating mode, satellites used in the position solution and DOP values.
GSV The number of GPS satellites in view satellite ID numbers, elevation, azimuth, and SNR values.
RMC Time, date, position, course and speed data provided by the GPS receiver.

4. Mechanical Drawing and Footprint

Items Description
Length 14.7±0.3mm
Width 13.1±0.3mm
Height 4.96±0.3mm

4.1 Recommended Footprint (TOP View)

4.2 Outline Drawing

5 RoHS Soldering Profile

5.1 Reflow Profile

High quality, low defect soldering requires identifying the optimum temperature profile for reflowing the solder paste. To have the correct profile assures components, boards, and solder joints are not damaged and reliable solder connection is achievable. Profiles are essential for establishing and maintaining processes. You must be able to repeat the profile to achieve process consistency. The heating and cooling rise rates must be compatible with the solder paste and components. The amount of time that the assembly is exposed to certain temperatures must first be defined and then maintained.

5.2 Storage and Baking Condition

1. Calculated shelf life in sealed bag: 6 months at <40 and <90% relative °C humidity(RH).

2. After bag is opened, devices that will be subjected to reflow soldering or other high temperature process must be :

2-1. Mounted within: 24 hours of factory conditions 30°C /60% RH, or
2-2. Stored at <10% RH under the protection against humidity and static electricity

3. Devices require bake before mounting, if :
3-1. Humidity indicator Card is >60% when read at 23±5°C
3-2. 2-1 or 2-2 not met

4. If baking is required, devices may be baked for 24 hours at 125±5°C

Note: if device containers cannot be subjected to high temperature or if shorter bake times are desired, reference IPC/JEDEC J-STD-020 for bake procedure