Specifications Sheet V0.1

Features:

• SiRF StarIV ultra low power chipset
• Compact module size for easy
• integration : 24 x 20 x 2.9 mm
• I2C/SPI pins reserved for
• customizing special user applications
  (Default: UART)
• Fully utilized SS4 upgrade features

1. Introduction

The GE-2420 GPS module is a high sensitivity, low power, Surface Mount Device (SMD) that can be compatible to GE348 or fully utilized SiRFstarIV upgrade features. This 48-channel global positioning system (GPS) receiver is designed for a wide range of OEM applications and is based on the GPS signal search capabilities of the SiRFstarIV GSD4e chipset, SiRF's newest chipset technology. The GE-2420 provides flexible I/O interfaces (UART is default, I2C and SPI by customer requirement).

The GE-2420 is designed to allow quick and easy integration into GPS-related applications such as:

• PDA, Pocket PC, Tablet and other computing devices
• Fleet Management /Asset Tracking
• AVL and Location-Based Services
• Hand-Held Device for Personal Positioning and Navigation
• All applications of battery drive device that needs lower power consumption

1.1 Features
1.1.1 Performance

• Highest performance GPS PVT engine
• High acquisition sensitivity for fast TTFF
• Extremely low weak signal tracking sensitivity
• High jamming immunity
• Smallest footprint and total solution size
• Highest level of BOM integration
• Value added software enhancements
• Multimode A-GPS (Autonomous, MS-Based, and MS-Assisted) - Need operator
• support
• Embedded CGEE / SGEE (Need server support)
• SiRFGeoRecov™ Reverse EE
• Cold/Warm/Hot Start Time: 35/35/1 sec. at open sky and stationary environments.
• Reacquisition Time: 0.1 second
• RF Metal Shield for best performance in noisy environments

1.2 Advantages

• Built-in LNA.
• Embed CGEE (Client Generated Extended Ephemeris) that can capture ephemeris data from satellites locally and predicts ephemeris out to 3 days. So if the module was off within 3 days, it could complete positioning process within 2 seconds just like hot start.
• It can remove in-band jammer up to 80db-Hz and track up to 8CW jammers, so the module can prevent GPS signal interference when design-in the electrical device with noisy electrical signal interferences such as Laptop, mobile phone, DSC, etc.
• Maintain tracking sensitivity as low as -163dBm, even without network assistance. (SiRF StarIII has only -159dBm sensitivity)
• Support SiRFaware technology
• Support adaptive "Micro Power Controller" power management mode
• Support MEMS sensor through I2C interface
• Only 8mW Trickle Power, so user can leave power on all day instead of power off
• Suitable for battery drive devices that need lower power consumption application
• Ideal for high volume mass production (Taping reel package)
• Cost saving through elimination of RF and board to board digital connectors
• Flexible and cost effective hardware design for different application needs

2. Specifications
2.1. Technical specifications

This model is defined to fully utilize SS4 extra upgrade features from SS3. Original design can also be compatible to GE348. The comparison is as below table:

2.2 Environmental Characteristics

2.3 Physical Characteristics

2.4 Interface Specifications

2.5. Reference design

• All ground pads attach directly to ground plane by way of via.
• All components are reference only

*1 Send a pulse from host

*2 BOOTSEL Table

3. Software

The GE-2420 module includes GSW4, the SiRF standard GPS software for SiRFstarIV low power single chipset receivers and its features include:

• Excellent sensitivity
• High configurability
• 1 Hz position update rate
• Supports use of satellite-based augmentation systems(WAAS, WAAS, EGNOS, MSAS,GAGAN)
• Enhanced Navigation Performance
• Improved Jamming Mitigation
• Improved Ephemeris Availability
• Default configuration is as follows:

  Item	Description
  Core of firmware	SiRF GSW4
  Baud rate	4800 bps
  Code type	NMEA-0183 ASCII
  Datum	WGS-84
  Protocol message	GGA(1sec), GSA(1sec), GSV(5sec), RMC(1sec),VTG(1sec)
  Output frequency	1 Hz

4. Electrical specifications

4.1 Block Diagram

4.2. Pin Settings

5. Mechanical Dimensions
5.1 Outline Drawing

Tolerance:

(Bottom View)

5.2 Recommended Footprint
(Unit : mm)

6. RoHS soldering profile
6.1 Reflow profile
High quality, low defect soldering requires identifying the optimum temperature profile for reflowing the solder paste. To have the correct profile assures components, boards, and solder joints are not damaged and reliable solder connection is achievable. Profiles are essential for establishing and maintaining processes. You must be able to repeat the profile to achieve process consistency. The heating and cooling rise rates must be compatible with the solder paste and components. The amount of time that the assembly is exposed to certain temperatures must first be defined and then maintained.

6.2 Storage & baking condition

1. Calculated shelf life in sealed bag: 6 months at <40°C and <90% relative humidity(RH).
2. After bag is opened, devices that will be subjected to reflow soldering or other high
temperature process must be:
a. Mounted within: 24 hours of factory conditions ≤30°C /60% RH, or
b. Stored at <10% RH under the protection against humidity and static electricity
3. Devices require bake before mounting, if:
a. Humidity indicator Card is >60% when read at 23±5°C
b. 2a or 2b not met
4. If baking is required, devices may be baked for 24 hours at 125±5°C