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GPS Module GE-2420

Specifications Sheet V0.1

Features:

  • SiRF StarIV ultra low power chipset
  • Compact module size for easy
  • integration : 24 x 20 x 2.9 mm
  • I2C/SPI pins reserved for
  • customizing special user applications
    (Default: UART)
  • Fully utilized SS4 upgrade features

1. Introduction

The GE-2420 GPS module is a high sensitivity, low power, Surface Mount Device (SMD) that can be compatible to GE348 or fully utilized SiRFstarIV upgrade features. This 48-channel global positioning system (GPS) receiver is designed for a wide range of OEM applications and is based on the GPS signal search capabilities of the SiRFstarIV GSD4e chipset, SiRF's newest chipset technology. The GE-2420 provides flexible I/O interfaces (UART is default, I2C and SPI by customer requirement).

The GE-2420 is designed to allow quick and easy integration into GPS-related applications such as:

  • PDA, Pocket PC, Tablet and other computing devices
  • Fleet Management /Asset Tracking
  • AVL and Location-Based Services
  • Hand-Held Device for Personal Positioning and Navigation
  • All applications of battery drive device that needs lower power consumption

1.1 Features
1.1.1 Performance

  • Highest performance GPS PVT engine
  • High acquisition sensitivity for fast TTFF
  • Extremely low weak signal tracking sensitivity
  • High jamming immunity
  • Smallest footprint and total solution size
  • Highest level of BOM integration
  • Value added software enhancements
  • Multimode A-GPS (Autonomous, MS-Based, and MS-Assisted) - Need operator
  • support
  • Embedded CGEE / SGEE (Need server support)
  • SiRFGeoRecov™ Reverse EE
  • Cold/Warm/Hot Start Time: 35/35/1 sec. at open sky and stationary environments.
  • Reacquisition Time: 0.1 second
  • RF Metal Shield for best performance in noisy environments

1.2 Advantages

  • Built-in LNA.
  • Embed CGEE (Client Generated Extended Ephemeris) that can capture ephemeris data from satellites locally and predicts ephemeris out to 3 days. So if the module was off within 3 days, it could complete positioning process within 2 seconds just like hot start.
  • It can remove in-band jammer up to 80db-Hz and track up to 8CW jammers, so the module can prevent GPS signal interference when design-in the electrical device with noisy electrical signal interferences such as Laptop, mobile phone, DSC, etc.
  • Maintain tracking sensitivity as low as -163dBm, even without network assistance. (SiRF StarIII has only -159dBm sensitivity)
  • Support SiRFaware technology
  • Support adaptive "Micro Power Controller" power management mode
  • Support MEMS sensor through I2C interface
  • Only 8mW Trickle Power, so user can leave power on all day instead of power off
  • Suitable for battery drive devices that need lower power consumption application
  • Ideal for high volume mass production (Taping reel package)
  • Cost saving through elimination of RF and board to board digital connectors
  • Flexible and cost effective hardware design for different application needs

2. Specifications
2.1. Technical specifications

Feature Item Description
Chipset GSD4e SiRF StarIV low power single chipset
General Frequency L1, 1575.42 MHz
C/A code 1.023 MHz chip rate
Channels 48
Accuracy Position 10 meters, 2D RMS
<5 meters 2D RMS, WAAS corrected
Velocity 0.1 meters/second
Time 1 microsecond synchronized to GPS time
Datum Default WGS-84
Other selectable for other Datum
Time to First Fix (TTFF) (Open Sky & Stationary Requirements) Reacquisition 0.1 sec., average
Snap start 1 sec., average
Hot start 1 sec., average typical TTFF
Warm start 35 sec., average typical TTFF
Cold start 35 sec., average typical TTFF
Dynamic
Conditions
Altitude 18,000 meters (60,000 feet) max.
Velocity 515 meters/second (1000 knots) max.
Acceleration 4g, max.
Jerk 20 meters/second3, max.
Power Main power input 2.8 ~ 5.0 VDC input
Power consumption 56 mW
Supply Current 26 mA
Trickle Power 8mW
Backup Power 2.8 ~ 5.0 VDC input
Serial Port Electrical interface One full duplex serial TTL interface
Protocol messages NMEA-0183@4800 bps (Default)

This model is defined to fully utilize SS4 extra upgrade features from SS3. Original design can also be compatible to GE348. The comparison is as below table:

 
GSD4e Feature List
GE-2420
Compatible to
GE348
GE-2420
Full SS4 Features
Remark
  Power Management
1
Full Power
 
2
Trickle Power  
 
3
Push to Fix  
 
  Value added software enhancements
4
Multimode A-GPS(Autonomous, MS-Based, and MS-Assisted
Requires Operater Support
5
Embedded CGEE  
•*
* Production version support
6
SGEE
Requires Host "downloader"
7
SiRF GeoRecov Reverse EE
For post-processed navigation computation
  Interface
8
MEMS sensor I²C Interface  
 
9
Single 1.8 Vdc supply voltage  
Option
10
2.8Vdc to 5.5Vdc supply Voltage
 
11
Multiple host port interfaces (UART, I2C, and SPI) UART
(Default),
I²C, and SPI
UART
(Default),
I²C, and SPI
Option, Selected by hw pin(CTS/RTS) and it need to be selected by buyer before shipping
12
Single ON_OFF power control pin  
 
13
Wakeup pin for external regulator
shutdown control
 
 
14
Reset control pin
•*
* Production version support
15
Backup battery pin
•*
* Production version support
16
1.8V I/O interface
•**
•**
** Option
  External Device Support
17
MEMS support  
 

2.2 Environmental Characteristics

Items Description
Operating temperature rage -40 deg. C to +85 deg. C
Storage temperature range -40 deg. C to +85 deg. C

2.3 Physical Characteristics

Items Description
Length 24 mm ± 0.3mm (0.94 in)
Width 20 mm ± 0.3mm (0.79 in)
Height 2.9 mm ± 0.3mm (0.11 in)
Weight 0.02 gram

2.4 Interface Specifications

Items Description
I/O 28 pin SMD micro package
Serial I/O Default: UART
I2C, SPI by customer request

2.5. Reference design

  • All ground pads attach directly to ground plane by way of via.
  • All components are reference only

*1 Send a pulse from host

Time Parameter Prior Event / State Symbol Min Typ Max Units
RTC startup time First power applied ΔT1   300   ms
ON_OFF Pulse time   ΔT2   1   ms

*2 BOOTSEL Table

  BOOTSEL
Normal L (GND)
Flash Loader H (1.8/3.3V)

3. Software

The GE-2420 module includes GSW4, the SiRF standard GPS software for SiRFstarIV low power single chipset receivers and its features include:

  • Excellent sensitivity
  • High configurability
  • 1 Hz position update rate
  • Supports use of satellite-based augmentation systems(WAAS, WAAS, EGNOS, MSAS,GAGAN)
  • Enhanced Navigation Performance
  • Improved Jamming Mitigation
  • Improved Ephemeris Availability
  • Default configuration is as follows:
    Item Description
    Core of firmware SiRF GSW4
    Baud rate 4800 bps
    Code type NMEA-0183 ASCII
    Datum WGS-84
    Protocol message GGA(1sec), GSA(1sec), GSV(5sec), RMC(1sec),VTG(1sec)
    Output frequency 1 Hz

4. Electrical specifications

4.1 Block Diagram

4.2. Pin Settings

PIN
GE348 GE-2420 (P t P) NEW GE-2420 (Full Func.) NEW
1
NC (Reserved) NC (Reserved) GPIO3(ECLK) Reserved
2
NC (Reserved) Reserved(WAKE) WAKE
3
NC (Reserved) NC (Reserved) GPIO8(EIT2) Reserved
4
RXDB NC NC
5
RXDA RXA RXA
6
TXDA TXA TXA
7
NC (Reserved) Reserved(ON_OFF) ON_OFF
8
TIME_MARK TIME_MARK TIME_MARK
9
NC (Reserved) NC (Reserved) VCC_1.8V(Reserved)
10
NC (Reserved) SPI_CLK(Option) SPI_CLK(Option)
11
NC (Reserved) NC (Reserved) GPIO4 (EIT) (Reserved)
12
NC (Reserved) NC (Reserved) GPIO2(TSYNC) (Reserved)
13
NC (Reserved) SPI_SS_N(Option) SPI_SS_N(Option)
14
GND GND GND
15
VSYSIN VSYSIN VSYSIN
16
VSTBY VSTBY VSTBY
17
BOOTSEL BOOTSEL BOOTSEL
18
RESETIN RESETIN RESETIN
19
GPS Status NC NC
20
GND GND GND
21
NC (Reserved) NC (Reserved) DR_SDA (Reserved)
22
NC (Reserved) NC (Reserved) DR_SDA (Reserved)
23
TXDB NC NC
24
NC (Reserved) NC NC
25
ANTPWR ANTPWR ANTPWR
26
GND GND GND
27
RF_IN RF_IN RF_IN
28
GND GND GND

5. Mechanical Dimensions
5.1 Outline Drawing

Tolerance:

Length 24.0 ± 0.3 mm
Width 20.0 ± 0.3 mm
Height 2.90 ± 0.3 mm

(Bottom View)

5.2 Recommended Footprint
(Unit : mm)

6. RoHS soldering profile
6.1 Reflow profile
High quality, low defect soldering requires identifying the optimum temperature profile for reflowing the solder paste. To have the correct profile assures components, boards, and solder joints are not damaged and reliable solder connection is achievable. Profiles are essential for establishing and maintaining processes. You must be able to repeat the profile to achieve process consistency. The heating and cooling rise rates must be compatible with the solder paste and components. The amount of time that the assembly is exposed to certain temperatures must first be defined and then maintained.

Average ramp-up rate 3°C/second max.
Preheat (Tsmax - Tsmin, ts) 150~200°C ; 60~180seconds
Time maintained above (TL, tL) 217°C; 60~150seconds
Peak Temperature (Tp) 255~260°C ; 10~20seconds
Ramp-down rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Maximum number of reflow cycles ≤3

6.2 Storage & baking condition

1. Calculated shelf life in sealed bag: 6 months at <40°C and <90% relative humidity(RH).
2. After bag is opened, devices that will be subjected to reflow soldering or other high
temperature process must be:
a. Mounted within: 24 hours of factory conditions ≤30°C /60% RH, or
b. Stored at <10% RH under the protection against humidity and static electricity
3. Devices require bake before mounting, if:
a. Humidity indicator Card is >60% when read at 23±5°C
b. 2a or 2b not met
4. If baking is required, devices may be baked for 24 hours at 125±5°C

Note: if device containers cannot be subjected to high temperature or if shorter bake times are desired, reference IPC/JEDEC J-STD-020 for bake procedure