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GPS Module GE-1514

Specifications Sheet V0.1

Features:

  • SiRF StarIV ultra low power chipset
  • Compact module size for easy integration : 15 x 14 x 2.8 mm
  • I²C/SPI pins reserved for customizing special user applications
    (Default: UART)
  • Fully utilized SS4 upgrade features

1. Introduction
The GE-1514 GPS module is a high sensitivity, low power, Surface Mount Device (SMD) that fully utilized SiRFstarIV upgrade features. This 48-channel global positioning system (GPS) receiver is designed for a wide range of OEM applications and is based on the GPS signal search capabilities of the SiRFstarIV GSD4e chipset, SiRF’s newest chipset technology.
The GE-1514 provides flexible I/O interfaces (UART is default, I2C and SPI by customer requirement).

The GE-1514 is designed to allow quick and easy integration into GPS-related applications such as:

  • PDA, Pocket PC, Tablet and other portable and battery drive computing devices
  • Fleet Management /Asset Tracking
  • AVL and Location-Based Services
  • Hand-Held Device for Personal Positioning and Navigation

1.1 Features
1.1.1 Hardware and Software

  • Based on the high performance features of the SiRF Star IV low power single chipset.
  • Built-in high gain amplifier and bandpass filter
  • RoHS compliant (lead-free)
  • Compact module size for easy integration: 15x14x2.8 mm (590.6x551.2x110.2 mil)
  • SMT pads allow for fully automatic assembly processes equipment and reflow soldering

1.1.2 Performance

  • Highest performance GPS PVT Engine.
  • High acquisition sensitivity for fast TTFF
  • Extremely low weak signal tracking sensitivity
  • High jamming immunity
  • Smallest footprint and total solution size
  • Highest level of BOM integration
  • Value added software enhancements
  • Multimode A-GPS (Autonomous, MS-Based, and MS-Assisted) – Need operator support
  • Embedded CGEE / SGEE (Need server support)
  • SiRFGeoRecov™ Reverse EE
  • Cold/Warm/Hot Start Time: 35/35/1 sec. at open sky and stationary environments
  • Reacquisition Time: 0.1 second
  • RF Metal Shield for best performance in noisy environments

1.1.3 Performance

  • TTL level serial port for GPS communications interface
  • Protocol: NMEA-0183/SiRF Binary (default NMEA)
  • Baud Rate: 4800 bps

1.2 Advantages

  • Built-in LNA.
  • Embed CGEE (Client Generated Extended Ephemeris) that can capture ephemeris data from satellites locally and predicts ephemeris out to 3 days. So if the module was off within 3 days, it could complete positioning process within 2 seconds just like hot start.
  • It can remove in-band jammer up to 80db-Hz and track up to 8CW jammers, so the module can prevent GPS signal interference when design-in the electrical device with noisy electrical
  • signal interferences such as Laptop, mobile phone, DSC, etc.
  • Maintain tracking sensitivity as low as -163dBm, even without network assistance. (SiRF StarIII has only -159dBm sensitivity)
  • Support SiRFaware technology
  • Support adaptive "Micro Power Controller" power management mode
  • Support MEMS sensor through I²C interface
  • Only 8mW Trickle Power, so user can leave power on all day instead of power off
  • Suitable for battery drive devices that need lower power consumption application
  • Ideal for high volume mass production(Taping reel package)
  • Cost saving through elimination of RF and board to board digital connectors
  • Flexible and cost effective hardware design for different application needs

2. Specifications
2.1. Module architecture

2.2. Hardware Features

  • Based on the high performance features of the SiRF Star IV low power single chipset
  • Compact module size for easy integration: 15x14x2.8 mm (590.6x551.2x110.2 mil)
  • SMT pads allow for fully automatic assembly processes equipment and reflow soldering
  • RoHS compliant (lead-free). Halogen free is to be available

2.3. Software Features

The firmware used on GE-1514 module is GSW4, the software for SiRF StarIV low power single chipset receivers, and the default configuration is as following description:

Items Description
Core of firmware SiRF GSW4
Baud rate 4800 bps
Code type NMEA-0183 ASCII
Datum WGS-84
Protocol message GGA(1s), GSA(1s),GSV(5s), RMC(1s)
Output frequency 1Hz

2.4 Environmental Characteristics

Items Description
Operating temperature rage -40 deg. C to +85 deg. C
Storage temperature range -55 deg. C to +100 deg. C
Humidity Up to 95% non-condensing or a wet
bulb temperature of +35 deg. C

2.5 Physical Characteristics
The Physical dimensions of the GE-1514 GPS Module are as follow:

Items Description
Length 15.0 mm ± 0.3mm
Width 14.0 mm ± 0.3mm
Height 2.80 mm ± 0.3mm
Weight 1.8 g

2.6 Recommended GPS Antenna Specifications

Parameter Specifications
Antenna Type Right-hand circular polarized passive antenna
Frequency 1575.42 ± 1.023 MHz

2.7 ESD Specification

Air Discharge : 2 ; 4 ; 8 KV (direct)
Contact Discharge : 2 ; 4 KV (direct / indirect)

2.8 Reference design

  • All ground pads attach directly to ground plane by way of via.
  • All components are reference only

3. Performance Characteristics
3.1 Position and velocity accuracy

Accuracy Position <2.5M
Velocity 0.01 meters/second
Time 1 microsecond synchronized to GPS time

3.2 Dynamic constrains

Dynamic constrains Altitude 18,000 meters (60,000 feet) max.
Velocity 515 meters/second (1000 knots) max

3.3 Acquisition time

Mode
GE-1514 GPS module
TTFF Hot
(valid almanac, position, time & ephemeris)
1~2 s
TTFF Warm
(valid almanac, position, time)
9~15 s
TTFF Cold
(valid almanac)
25~35 s
re-acquisition
(<10 s obstruction with valid almanac, position,
time & ephemeris)
0.1 s

Note 1: Open Sky and Stationary Environments.

3.4 Sensitivity

Parameter Description
Tracking Sensitivity -163 dBm
Acquisition Sensitivity -148 dBm

4.Hardware Interface Power supply

Parameter GPS module
Input voltage 1.71~1.89 VDC
Battery backup voltage 1.71~1.89 VDC

4.1 Power Consumption

Status Power Consumption
Acquisitioning 48 mA
Tracking 40 mA

4.2. Specifications
4.2.1 Pin Settings

4.2.1 Pin Assignment

PIN
Name Type Description
1
GND PWR Ground
2
RF_IN PWR RF input
3
VSS PWR Ground
4
RESETN I External reset input, active low
5
VCCIN PWR DC +1.8V input
6
VSTBY PWR DC +1.8V input, RTC backup battery input
7
BOOTSEL I Pull high for programming mode.
8
Reserved N/A Keep floating
9
GND PWR Ground
10
TXA O UART_TX UART data transmit (TX)
11
RXA I UART_RX UART data transmit (RX)
12
Reserved N/A Keep floating
13
Reserved N/A Keep floating
14
TM O 1 PPS time mark output.
15
Reserved N/A Keep floating
16
Reserved N/A Keep floating

PIN
GE301 GE-1514
1
RF_GND RF_GND
2
RF_IN RF_IN
3
VSS VSS
4
RESETN RESETN
5
VCCIN VCCIN
6
VSTBY VSTBY
7
RXB BOOTSEL
8
TXB Reserved
9
GND GND
10
TXA TXA
11
RXA RXA
12
Reserved Reserved
13
Reserved Reserved
14
TM TM
15
Reserved Reserved
16
GPS Status Reserved

*TM (Time Mark): when GPS is fixed, the cycle will be shown as below:

4.3 Software interface
The host serial I/O port of the module’s serial data interface supports full duplex communication between the module and the user. The default serials are shown in Table 4-1.

Port Protocol Description
Port A NMEA 0183, 4800 bps GGA(1s), GSA(1s), GSV(5s), RMC(1s)
Port B N/A N/A
Table 4-1 GE-1514 GPS module default baud rates

4.4 NMEA output messages
The output NMEA (0183 v3.0) messages for the receiver are listed in Table 4-2. A complete description of each message is contained in the SiRF NMEA reference manual.

Option Description
GGA Time, position, and fix related data for a GPS receiver.
GSA GPS receiver operating mode, satellites used in the position
solution, and DOP values.
GSV The number of GPS satellites in view satellite ID numbers,
elevation, azimuth, and SNR values.
RMC Time, date, position, course and speed data provided by the GPS receiver.
Table 4-2 NMEA-0183 Output messages

4.5 SiRF Binary
A complete description of each binary message is contained in the SiRF Binary Protocol reference manual.

5. Mechanical drawing and footprint
5.1 Outline Drawing

Tolerance:
Length 24.0 ± 0.3 mm
Width 20.0 ± 0.3 mm
Height 2.90 ± 0.3 mm

5.2 Recommended Footprint (Top view)

Note:
1. Tolerance of recommended pad: 1.87 * 0.92 (+/- 0.1 mm )
2. Recommended pad for pin 9 is 2.3 * 1.5 mm ( +/- 0.1 mm )

6 Application Notes

  • The layout design prefers that the ground plane should cover all the module PCB.
  • All connection traces to the ground plane should be designed a short as possible.
7. RoHS soldering profile
7.1 Reflow profile
High quality, low defect soldering requires identifying the optimum temperature profile for reflowing the solder paste. To have the correct profile assures components, boards, and solder joints are not damaged and reliable solder connection is achievable. Profiles are essential for establishing and maintaining processes. You must be able to repeat the profile to achieve process consistency. The heating and cooling rise rates must be compatible with the solder paste and components. The amount of time that the assembly is exposed to certain temperatures must first be defined and then maintained.


Average ramp-up rate 3°C/second max.
Preheat (Tsmax – Tsmin, ts) 150~200°C ; 60~180seconds
Time maintained above ( TL, tL) 217°C ; 60~150seconds
Peak Temperature (Tp) 255~260°C ; 10~20seconds
Ramp-down rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Maximum number of reflow cycles ≤3

7.2 Storage & baking condition

1. Calculated shelf life in sealed bag: 6 months at <40°C and <90% relative humidity(RH).
2. After bag is opened, devices that will be subjected to reflow soldering or other high temperature process must be:
a. Mounted within: 24 hours of factory conditions ≤30°C /60% RH, or
b. Stored at <10% RH under the protection against humidity and static electricity
3. Devices require bake before mounting, if:
a. Humidity indicator Card is >60% when read at 23±5°C
b. 2a or 2b not met
4. If baking is required, devices may be baked for 24 hours at 125±5°C

Note: if device containers cannot be subjected to high temperature or if shorter bake times are desired, reference IPC/JEDEC J-STD-020 for bake procedure